For both AMD and Intel, the year 2027 promises to be rich in major launches.
Market inflation, first in DRAM, then in NAND, has put the brakes on the whole world of computing. Today, we're not just talking about the price of RAM modules or SSDs, but of all devices that use these components. As a result, industry players are raising their prices and are logically reluctant to launch new product lines: the main programs seem to be postponed until the second half of 2026, or even early next year, and this is particularly true of microprocessor designers, led by AMD and Intel.
Gorgon Point and Medusa Point: the next generation of mobile chips from AMD © VideoCardz
While the Panther Lake range was launched at the very beginning of the year at CES in Las Vegas, Intel should have nothing major to present for the rest of the year. As for AMD, all rumors point to the arrival of the new Zen 6 architecture chips in early 2027 at best. This is even an " optimistic " estimate, according to information published on the BenchLife site and relayed by VideoCardz. But whether it's early or mid-next year, Zen 6 promises to be a minor revolution for AMD, which can't afford to miss out when Panther Lake has shown that Intel is doing better.
Zen 6 will benefit from the latest etching node from the world's number one foundry, Taiwan's TSMC. Called N2, this process is akin to 2 nm and should logically enable many more transistors to be fitted on the same surface. In fact, early reports on Zen 6 suggest a maximum of 12 cores per CCD, compared with AMD's previous limit of 8 cores. The most powerful processor of the next generation - with the highly hypothetical name of Ryzen 9 10950X - could therefore feature 24 cores and a third-level cache of 48 MB per CCD, for a total of 96 MB. That's almost 100 MB of cache, not to mention 3D Vertical Cache technology. A record.
Zen 6 will be the first AMD architecture to benefit from TSMC's N2 process © VideoCardz
Last but not least, TSMC's promised fineness of engraving would also allow AMD greater flexibility: all the indications are that the American group plans to offer processors with 6, 8, 10 and 12 cores for single-die models, and 16, 20 and 24 cores for dual-die chips. This greater room for maneuver would enable AMD to offer a wider range of references, with fewer price differences between models. However, all this remains conditional: 2027 is still a long way off, and AMD has not yet begun communicating about Zen 6. Not officially, anyway.
